Advanced Cooling Solutions for Semiconductor Fabrication: The Case of Micron Semiconductor (Xi’an)

Micron Technology, founded in 1978 and headquartered in Boise, Idaho, is a global leader in semiconductor solutions, specializing in memory and storage technologies. Its core product portfolio includes DRAM, NAND flash, NOR flash, and 3D XPoint™ technology, which are widely applied in data centers, artificial intelligence, 5G communications, and automotive electronics. Driven by continuous innovation, Micron ranked sixth globally in semiconductor revenue in 2024 and has become a key supplier in AI storage, providing high-bandwidth memory (HBM) to companies such as NVIDIA. The company is actively developing advanced process technologies such as 1γ DDR5 and benefits from policy support under initiatives like the U.S. CHIPS and Science Act. Concurrently, Micron continues to expand its investment in China to reinforce its competitive position in the global market.

Among Micron’s global operations, Micron Semiconductor (Xi’an) serves as its most critical manufacturing hub in China. The Xi’an facility plays a central role in Micron’s global DRAM packaging, testing, and module production. In 2023, the site recorded a total import-export volume of CNY 75 billion, representing a substantial contribution to Micron’s global supply chain. In June 2023, Micron announced an additional investment of CNY 4.3 billion in Xi’an to initiate a “World-Class Factory” expansion plan. This initiative includes the construction of a new 35,000-square-meter facility, integration of AI-powered automation solutions, a design adhering to LEED Gold certification standards, the addition of mobile DRAM, NAND flash, and SSD production lines, and further enhancement of its DRAM packaging and testing capabilities. These upgrades aim to meet the growing demand for high-capacity storage in applications such as new energy vehicles and AI-powered PCs (AIPCs).

As a critical component in semiconductor manufacturing, the Process Cooling Water (PCW) system plays a central role in thermal management. In this project, Shanghai Accessen supplied AU-series plate heat exchangers for the expansion and retrofit of the utility equipment room on the second floor of the B5 production facility. These exchangers are used to cool the PCW system by transferring heat from the process water to chilled water supplied by chillers or cooling towers. Once cooled, the process water—typically high-purity or ultrapure semiconductor-grade water—is filtered and recirculated to the production equipment in a closed-loop system. This ensures that fabrication tools operate under stable thermal and pressure conditions, thereby maintaining production stability and meeting stringent process requirements. The AU-series plate heat exchangers from Accessen have obtained China’s Tier 1 energy efficiency certification. These units offer enhanced heat transfer performance with significantly lower pressure drop compared to traditional heat exchangers, which substantially reduces energy consumption throughout the product lifecycle. Additionally, certified energy-saving products like these qualify for national tax incentives under China’s energy efficiency promotion policies.

Accessen leverages advanced heat exchange technologies and premium-grade materials to produce high-quality heat exchangers. Its products have earned multiple international certifications, including ASME, AHRI, CE, and ABS. Backed by robust product reliability and comprehensive after-sales support, Accessen offers efficient thermal management solutions for process water cooling in semiconductor packaging and testing lines. These systems help minimize production downtime caused by thermal fluctuations, pressure instability, or water contamination, ultimately improving production efficiency and semiconductor product quality. This project represents yet another endorsement of Accessen’s capabilities in the semiconductor industry, building on its successful deployments with leading firms such as Samsung Semiconductor, Applied Materials, ChangXin Memory Technologies, STMicroelectronics, SMIC, BOE, HKC, CSOT, Tianma Microelectronics, Sanan Optoelectronics, and JCET.